Tin Whiskers: Electron Microscopy and EBSD Characterization
نویسندگان
چکیده
منابع مشابه
Tin Whiskers: Attributes And Mitigation
The movement to eliminate lead (Pb), especially active in Japan and the European Union, has resulted in an increasing use of pure tin (Sn) coatings on leads and other external and internal surfaces of capacitors, resistors, and other passive components. This paper discusses the issues of tin whisker growth with respect to passive components. It also presents both a critical analysis of existing...
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The elimination of lead in electronic equipment due to governmental regulations (European Union End of Life Vehicle Directive and European Union Restriction of Hazardous Substances Directive) has increased the risk of electrical shorting due to the formation of tin whiskers in electronic products. Tin whiskers are hair-like tin structures that grow sporadically on surfaces coated with tin. Whis...
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The term “electron backscatter diffraction” (EBSD) is now synonymous with both the scanning electron microscope (SEM) technique and the accessory system that can be attached to an SEM. EBSD provides quantitative microstructural information about the crystallographic nature of metals, minerals, semiconductors, and ceramics—in fact most inorganic crystalline materials. It reveals grain size, grai...
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The growth of metallic (predominantly Sn) whiskers from pure metallic platings has been studied for over 50 years. While the phenomenon of Sn whiskering has been studied for decades, very little is known about the mechanical properties of these materials. This can be attributed to the difficulty in handling, gripping, and testing such fine-diameter and high-aspect-ratio whiskers. We report on t...
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ژورنال
عنوان ژورنال: Microscopy and Microanalysis
سال: 2010
ISSN: 1431-9276,1435-8115
DOI: 10.1017/s1431927610054164